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FEP Film

FEP film is a hot melt extruded casting film made of FEP resin (fluorinated ethylene propylene copolymer). FEP film offers almost all of the excellent properties of fluorine film, such as high temperature resistance, chemical corrosion resistance, non-stick properties and excellent electrical properties. FEP film can be thermowelded, thermoformed, and can be combined with a variety of materials, and is widely used in biomedicine, electronic manufacturing, insulation and anti-corrosion fields.


Material characteristics

Non-stick properties
01
Excellent non-stick and low surface friction properties make the material surface less likely to adhere to other substances.
01
Light transmittance
02
High all-over light transmittance of up to 92% allows light to pass through the material virtually unobstructed.
02
Corrosion resistance
03
Excellent chemical stability, resistant and corrosion-resistant to a wide range of chemicals.
03
Mechanical properties
04
It has been tested many times for mechanical properties and maintains its original shape under high pressure and strong external forces.
04
Heat resistance
05
Long-term stable working temperature up to 205°C, maintain stability under high temperature conditions, not easy to deformation.
05
Electrical performance
06
Low conductivity, high radiation resistance, with the advantage of cross-linking through high-energy radiation, effectively isolating currents and electric fields.
06

Color category

Clear

Red

产品系列

FEP films made from 100% high specification pure FEP resin. Widely used in high electrical performance applications such as PCB lamination, wire and cable markets.The HG series can also be used in high end optical applications such as protective, decorative,...

FEP HP (High Performance Grade)

Due to its excellent surface non-stick properties, FEP films are the best choice for mold release films for high temperature composites, as they provide long term release properties up to 205°C. FEP films are also the best choice for mold release films for high temperature composites. They also exhibit high ductility and lamination stability in their complex shapes.

FEP MR (Mold Release Grade)

Offers a 15-20% cost advantage over the PG series. Optimal material for heat sealing, bonding and other melt bonding applications where appearance is not critical.

FEP WG (Welding Grade)

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