ETFE film is the material of choice for film assisted molding processes for semiconductors and integrated circuits.

In the semiconductor packaging process, ETFE is recognized as the most commonly used release film in the industry. Film assisted forming (FAM) is a key process in modern integrated circuit manufacturing. In this process, ETFE film reduces the stripping force when the IC is removed from the mold, and the mold does not need to be inspected or cleaned between injection shots, so it is used to increase the yield and productivity of the machine.

Practical application case:

For example, the well-known Apple wearable device Apple Watch, its powerful S9 chip integrated the entire computer architecture, including application processor, panel display, Wi-Fi, NFC, power management and other subsystems, through the stacked staggered SiP technology package integration. ETFE film plays a crucial role in the packaging process.

ETFE semiconductor film advantages:

1.Non-stick properties:

ETFE semiconductor film can meet the requirements of maintaining non-adhesive energy at high temperature, low surface energy, will not pollute the mold and copper foil, and the surface is clean and pollution-free after release, which is a good release film for high temperature composite material molding.

2.High temperature extension:

High heat resistance, in the wide continuous use temperature range of -200 ° C to 165 ° C (-328 ° F to 330 ° F), ETFE film has superior release performance and flexibility, with high elongation and excellent fit softness, to meet the needs of different shapes of molds, and is widely used in complex molds.

High tensile and tear strength at high temperatures, which can effectively avoid film breakage and play a protective buffer role-by reducing the impact of solid sheet and mantle/overflow, you can prevent IC chip damage; Soften the impact during forming and prevent PKG of the ceramic substrate from being damaged.

3.Self-cleaning: low surface tension is not easily contaminated with dirt and easy to clean

Due to the extremely small size of semiconductors, even the slightest contamination can impair their performance, and keeping the microchip clean during the manufacturing process is essential to reduce potential contamination or damage caused by micro-impurities.

Semiconductor manufacturing involves ultra-high purity chemicals and solvents, and ETFE film reduces the release force required to remove molded integrated circuits from the mold, provides a wrinkle-free surface after molding, no impurity precipitation, does not contaminate the mold and copper foil, and is a good release film for high temperature composite molding.

4.Chemical corrosion resistance: acid, alkali, chemical agents and other harsh conditions

In the semiconductor manufacturing process, such as wafer cleaning, etching, etc., a large number of electronic gases or chemicals are used, most of these materials are highly corrosive, so the pipeline, pump valve, storage container and other components or lining materials used for transportation and storage are required to have outstanding chemical corrosion resistance and low precipitation.

ETFE film ensures that highly corrosive chemicals in the chip manufacturing process do not contaminate ultra-clean environments.

5.Customization:

Customizable colors such as light blue, red and frosted translucent white; Various perforated film can be made.